Passive heat transfer or active temperature control
High efficiency heat transfer
Fully configurable package pin-out
Multiple mounting option base plate
Solderless, field replaceable connectors
212 DIL LaserMount / 214 TEC DIL
LaserMount
DIL butterfly laser
ZIF socket for quick insertion and removal of the device
Passive heat sinking (212); or active temperature control (214), -5°C to +85°C
Provides electrical connection to Mini-DIL (no heat sinking)
224 TEC TO-Can LaserMount
5.6mm and 9mm TO-Can packages
Active temperature control, +15°C to +85°C
Switch configured – no wiring or soldering required to configure for your device
Post mountable (post mount not included)
240 Series LaserMount
Supports up to 10A devices
Integrated fan for high heat load operation with smart fan control when used
with a 5300 Series TECSource
242 C-Pack LaserMount adds active temperature control (-5°C to +85°C) for
C-Packs,with nitrogen purge for low temperature operation, and a precision alignment
guide and quick cathode clamp