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 LaserMounts 200 Series
202 Butterfly LaserMount / 204 TEC Butterfly LaserMount
  • 14-Pin Butterfly package
  • Passive heat transfer or active temperature control
  • High efficiency heat transfer
  • Fully configurable package pin-out
  • Multiple mounting option base plate
  • Solderless, field replaceable connectors
212 DIL LaserMount / 214 TEC DIL LaserMount
  • DIL butterfly laser
  • ZIF socket for quick insertion and removal of the device
  • Passive heat sinking (212); or active temperature control (214), -5°C to +85°C
  • Provides electrical connection to Mini-DIL (no heat sinking)

 

224 TEC TO-Can LaserMount
  • 5.6mm and 9mm TO-Can packages
  • Active temperature control, +15°C to +85°C
  • Switch configured – no wiring or soldering required to configure for your device
  • Post mountable (post mount not included)

 

240 Series LaserMount
  • Supports up to 10A devices
  • Integrated fan for high heat load operation with smart fan control when used with a 5300 Series TECSource
  • 242 C-Pack LaserMount adds active temperature control (-5°C to +85°C) for C-Packs,with nitrogen purge for low temperature operation, and a precision alignment guide and quick cathode clamp
  • Passive heat sinking for HHL and TO-3 devices
  • High efficiency heat transfer
  • Post mountable 
Micro 5.6 & Micro 9.0 LaserMounts
  • 5.6mm (Micro 5.6) and 9mm (Micro 9.0) devices
  • Passive heat sinking
  • Simple clamping mechanism
  • TO-Can to LDD male DB9 cable available
  • Post mountable (post mount not included)