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LaserMounts 200 Series |
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202 Butterfly LaserMount / 204 TEC
Butterfly LaserMount |
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- 14-Pin Butterfly package
- Passive heat transfer or active temperature control
- High efficiency heat transfer
- Fully configurable package pin-out
- Multiple mounting option base plate
- Solderless, field replaceable connectors
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212 DIL LaserMount / 214 TEC DIL
LaserMount |
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- DIL butterfly laser
- ZIF socket for quick insertion and removal of the device
- Passive heat sinking (212); or active temperature control (214), -5°C to +85°C
- Provides electrical connection to Mini-DIL (no heat sinking)
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224 TEC TO-Can LaserMount |
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- 5.6mm and 9mm TO-Can packages
- Active temperature control, +15°C to +85°C
- Switch configured – no wiring or soldering required to configure for your device
- Post mountable (post mount not included)
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240 Series LaserMount |
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- Supports up to 10A devices
- Integrated fan for high heat load operation with smart fan control when used
with a 5300 Series TECSource
- 242 C-Pack LaserMount adds active temperature control (-5°C to +85°C) for
C-Packs,with nitrogen purge for low temperature operation, and a precision alignment
guide and quick cathode clamp
- Passive heat sinking for HHL and TO-3 devices
- High efficiency heat transfer
- Post mountable
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Micro 5.6 & Micro 9.0 LaserMounts |
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- 5.6mm (Micro 5.6) and 9mm (Micro 9.0) devices
- Passive heat sinking
- Simple clamping mechanism
- TO-Can to LDD male DB9 cable available
- Post mountable (post mount not included)
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